| 1X Mirror Projection |
| Auto Feeder: |
Single or double, cassette to cassette, backside wafer handling |
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| Wafer Sizes: |
4”, 5”, 6” |
| Mask Sizes: |
5”, 6”, 7” |
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| Resolution: |
1.5 um (using positive resist)
|
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| Illumination |
| 2kw high pressure mercury lamp |
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| Wavelengths used: |
365nm(i-line) 405nm(h-line) 436nm(g-line)
|
| Intensity: |
(@ 1800watts power output) 4”wafer-more than 700mw, 5”wafer-more than 650mw, 6”wafer-more than 600mw
|
| Intensity / Exposure Uniformity: |
within +-3%
|
| CTC |
| Constant Temperature Control – monitors and controls system temp. within +-.3 degrees C. |
| |
| PDC |
| matic Distortion Control – provides fine distortion compensation
|
| Automatic Alignment |
| HeNe (633nm) Laser Beam Scanning
|
| |
| Alignment Modes: |
Spot Beam / Sheet Beam
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| Accuracy: |
3sigma <=.54um
|
| |
| Required Facilities: |
|
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| MPA-600FA: |
200 VAC, 3Phase, 6 kVA, 50/60Hz |
| Air Supply(CTC): |
200 VAC, 3Phase, 8 kVA, 50/60Hz |
| CDA(Clean Dry Air)Pressure: |
minimum 6.5 kg/cm2 , flow rate 130 lit/min |
| Vacum: |
50 cmHg or more |
| Exhaust Flow(for illuminator): |
6.5 m/sec to 9.5 m/sec (measured at illuminator output) |
